Research and Design of Metal Film Resistance Test System: Taking Metal Pt Thin Film as an Example

Ya-lin WANG , Ming-wu CHEN , Jia-hao CHEN , Jin-liang FENG , Zeng-li GUO , Jian LIU , Ke WANG

Science Technology and Engineering ›› 2025, Vol. 25 ›› Issue (26) : 11220 -11229.

PDF
Science Technology and Engineering ›› 2025, Vol. 25 ›› Issue (26) : 11220-11229 DOI: 10.12404/j.issn.1671-1815.2500678
research-article
Research and Design of Metal Film Resistance Test System: Taking Metal Pt Thin Film as an Example
Author information +
History +
PDF

Abstract

The resistivity of metal films grown by magnetron sputtering is one of the important parameters for evaluating and selecting material. In order to obtain high-precision value of film resistivity, Pt films were choosed for investigation, and the four-line method by inverting the Van Pauw function were optimized to design the test system, and the AC/DC four-line method was used to carry out the experimental data acquisition on this system. The experimental results show that the Van der Pauw correction factor f can match the value below 0.7, which expands the application range of the system test. DC four-wire method is found to be more susceptible to the influence of offset voltage and test current, and AC four-wire method has better anti-interference ability than DC four-wire method. In order to evaluate the accuracy of the system test, the results measured by AC four-wire method are compared with those measured by Keithley-2400 source meter and Keithley-2182A nanovolt-meter. The relative error is less than 1.92%. Our test system has practical application, which provides important reference for the uniformity detection of precision films.

Keywords

film resistance / Van der Pauw function / inverse optimization / AC/DC four-wire method

Cite this article

Download citation ▾
Ya-lin WANG, Ming-wu CHEN, Jia-hao CHEN, Jin-liang FENG, Zeng-li GUO, Jian LIU, Ke WANG. Research and Design of Metal Film Resistance Test System: Taking Metal Pt Thin Film as an Example. Science Technology and Engineering, 2025, 25(26): 11220-11229 DOI:10.12404/j.issn.1671-1815.2500678

登录浏览全文

4963

注册一个新账户 忘记密码

References

Funding

PDF (7451KB)

18

Accesses

0

Citation

Detail

Sections
Recommended

/

〈 〉