Influence of Wall Wettability of Coaxial Microchannel on Microbubble Generation Characteristics

Qin WANG , Li-xia SUN , Yu-feng ZHANG , Qi-jiu ZHANG , Hong-yang NING , Zhi-jie HUANG

Science Technology and Engineering ›› 2024, Vol. 24 ›› Issue (2) : 690 -697.

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Science Technology and Engineering ›› 2024, Vol. 24 ›› Issue (2) : 690-697 DOI: 10.12404/j.issn.1671-1815.2305012
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Influence of Wall Wettability of Coaxial Microchannel on Microbubble Generation Characteristics
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Abstract

The generation time and size of microbubbles have an important influence on the efficiency of sewage treatment. In order to investigate the influence of surface wettability of microchannel on microbubble generation features, two-phase fluid flow level set was adopted to simulate microbubble generation process at different contact angles. Contact angle was taken as the master variable, liquid flow rate, gas pressure and gas type as sub-variables, and the effects of sub-variables on microbubble generation time and detached bubble volume were investigated. A coaxial microfluidic chip was designed and fabricated, and experiments were carried out on the features of microbubble generation. The results show that the microbubble generation time decreases with increasing contact angle from 0° to 180°, and the detached bubble volume first increases and then decreases. The contact angle of 90° is the demarcation point of microbubble generation time and the peak point of detached bubble volume. In addition, among the three sub-variables, the change of liquid flow rate has a significant effect on the generation features of microbubbles. The larger the liquid flow rate, the smaller the generation time and detached bubble volume. The deviation between measured values and simulated values is ± 10%, which verifies the effect of wettability on microbubble generation features.

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Qin WANG, Li-xia SUN, Yu-feng ZHANG, Qi-jiu ZHANG, Hong-yang NING, Zhi-jie HUANG. Influence of Wall Wettability of Coaxial Microchannel on Microbubble Generation Characteristics. Science Technology and Engineering, 2024, 24(2): 690-697 DOI:10.12404/j.issn.1671-1815.2305012

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