In order to improve the heat dissipation performance of medium and high temperature electronic devices, taking the pin-fin heat sink module as the research object. The effects of five structural parameters, such as heat pipe length, radiator width, pin-fin diameter, pin-fin spacing and pin-fin height, on the heat dissipation performance of fins were studied. The flow and heat transfer performance of fins under 16 combination schemes of orthogonal experimental design was simulated. Taking Nu, drag coefficient f, heat transfer performance comprehensive evaluation index performance evaluation criteria (PEC) and full factor evaluation Y as evaluation indexes, the main influencing factors were analyzed by range analysis and the optimal combination was selected under each evaluation index. The results show that the main factor affecting Nu, f, PEC and Y is the needle-fin spacing. The optimum combination is as follows: pin-fin spacing is 2.5 mm, radiator width is 80 mm, pin-fin diameter is 1.5 mm, pin-fin height is 20 mm, heat pipe length is 25 mm, module temperature drop is 16.28 ℃, thermal resistance is 0.265 ℃/W.