为探究原位热处理耦合技术加热土壤的作用机制和影响因素，采用二维实验装置模拟了热处理过程，研究了蒸汽注射耦和热传导加热效果，分析了蒸汽流量、耦合方式等对升温过程的影响。结果表明，在热传导的基础上耦合蒸汽注射处理可以加快热量传递、减少热损失，使加热时间缩短35.67%、能耗降低24.53%。蒸汽注射强化升温主要机制为：额外的热量注入增大了温差，增强了由浮力驱动的液相对流传热；蒸汽在浮力或压力的作用下向上迁移，增强了气相对流传热。热传导和蒸汽注射耦合处理时，增大蒸汽流量和改变耦合方式对能耗影响均较小，将蒸汽流量从0.18 kg/h增大加0.54 kg/h能将加热时间缩短22.05%，但将水消耗增加了132.43%；热传导加热30 min后再耦合蒸汽注射较两者同时加热可以减少28.57%的水消耗，但将加热时间延长3.84%。工程应用中，宜根据工期、成本等筛选合适的修复方案。

To investigate the mechanism and influencing factors of soil heating with coupled in situ thermal technology, a two-dimensional experimental setup was used to simulate the heat treatment process, and the effects of coupled steam injection on thermal conductive heating as well as the effects of steam injection rate and heating mode on the application of the thermal conductive heating and steam injection technology were investigated. The results show that coupling steam injection on the basis of thermal conductive heating treatment can accelerate heat transfer, reduce heat loss, shorten the heating time by 35.67%, and reduce energy consumption by 24.53%. The main mechanism of steam injection enhanced heating is as follows. The additional heat injection increases the temperature difference, which in turn enhances convective heat transfer in the liquid phase driven by buoyancy. The upward migration of steam under buoyancy or pressure to enhance convective heat transfer in the gas phase. In thermal conductive heating and steam injection treatment, changing the steam injection rate or heating mode had a small effect on the treatment energy consumption, increasing the steam flow rate from 0.18 to 0.54 kg/h can shorten the heating time by 22.05%, but increase the water consumption by 132.43%. Compared with the thermal conductive heating and steam injection heated at the same time, thermal conductive heating heated for 30 min and then coupled with steam injection can reduce the water consumption by 28.57%, but will extend the heating time by 3.84%. In engineering applications, suitable restoration solutions should be selected based on duration, cost, etc.